http://ir.sinica.edu.tw/handle/201000000A/34746| Title: | Low-Cost and TSV-free Monolithic 3D-IC with Heterogeneous Integration of Logic, Memory and Sensor Analogy Circuitry for Internet of Things | Authors: | Tsung-Ta Wu Chang-Hong Shen Jia-Min Shieh Wen-Hsien Huang Hsing-Hsiang Wang Fu-Kuo Hsueh Hisu-Chih Chen Chih-Chao Yang Tung-Ying Hsieh Bo-Yuan Chen Yu-Shao Shiao Chao-Shun Yang Guo-Wei Huang Kai-Shin Li Ting-Jen Hsueh Chien-Fu Chen Wei-Hao Chen Fu-Liang Yang Meng-Fan Chang Wen-Kuan Yeh |
Issue Date: | 2015-12-07 | Conference: | International Electron Devices Meeting (IEDM) (Washington, DC, USA : IEEE) | URI: | http://ir.sinica.edu.tw/handle/201000000A/34746 |
| Appears in Collections: | 應用科學研究中心 |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.
