Localized electrochemical deposition of copper monitored using real-time X-ray microradiography

Please use this identifier to cite or link to this item: http://ir.sinica.edu.tw/handle/201000000A/46959

Title:	Localized electrochemical deposition of copper monitored using real-time X-ray microradiography
Authors:	Seol, S. -K. Pyun, A. -R. Hwu, Y. Margaritondo, G. Je, J. -H.
Issue Date:	2005-06-01
Relation:	ADVANCED FUNCTIONAL MATERIALS15(6), 934-937
URI:	http://ir.sinica.edu.tw/handle/201000000A/46959
Appears in Collections:	物理研究所

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