Bonding and high temperature reliability of NiFeMo alloy/n-type PbTe joints for thermoelectric module applications

Please use this identifier to cite or link to this item: http://ir.sinica.edu.tw/handle/201000000A/49234

Title:	Bonding and high temperature reliability of NiFeMo alloy/n-type PbTe joints for thermoelectric module applications
Authors:	Haiyang Xia Fivos Drymiotis Cheng-Lung Chen Aiping Wu Yang-Yuan Chen G. Jeffrey Snyder
Issue Date:	2015-04
Relation:	JOURNAL OF MATERIALS SCIENCE 50, 2700-2708
URI:	http://ir.sinica.edu.tw/handle/201000000A/49234
ISSN:	http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=Drexel&SrcApp=hagerty_opac&KeyRecord=0022-2461&DestApp=JCR&RQ=IF_CAT_BOXPLOT
URL:	http://link.springer.com/article/10.1007%2Fs10853-015-8820-8
Appears in Collections:	物理研究所

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