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  1. Scholars Hub of the Academia Sinica
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Please use this identifier to cite or link to this item: http://ir.sinica.edu.tw/handle/201000000A/85281
Title: RePAIR: A ReRAM-based Processing-in-Memory Accelerator for Indel Realignment
Authors: Ting Wu
Chin-Fu Nien
Kuang-Chao Chou
Hsiang-Yun Cheng 
Issue Date: 2022-03
Conference: IEEE/ACM Design, Automation Test in Europe (DATE)
URI: http://ir.sinica.edu.tw/handle/201000000A/85281
Appears in Collections:資訊科技創新研究中心

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