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Please use this identifier to cite or link to this item: http://ir.sinica.edu.tw/handle/201000000A/88056
Title: Nanometer-thick Copper Films with Low Resistivity Grown on 2D Material Surfaces
Authors: Yu-Wei Liu
Dun-Jie Zhang
Po-Cheng Tsai
Chen-Tu Chiang
Wei-Chen Tu
Shih-Yen Lin 
Issue Date: 2022-02
Relation: SCIENTIFIC REPORTS 12, 1823
URI: http://ir.sinica.edu.tw/handle/201000000A/88056
ISSN: http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=Drexel&SrcApp=hagerty_opac&KeyRecord=2045-2322&DestApp=JCR&RQ=IF_CAT_BOXPLOT
URL: https://doi.org/10.1038/s41598-022-05874-9
Appears in Collections:應用科學研究中心

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