| Issue Date | Title | Author(s) | Relation | scopus | WOS | Fulltext/Archive link |
|---|---|---|---|---|---|---|
| 2015 | Low-Cost and TSV-free Monolithic 3D-IC with Heterogeneous Integration of Logic, Memory and Sensor Analogy Circuitry for Internet of Things | Tsung-Ta Wu; Chang-Hong Shen; Jia-Min Shieh; Wen-Hsien Huang; Hsing-Hsiang Wang; Fu-Kuo Hsueh; Hisu-Chih Chen; Chih-Chao Yang; Tung-Ying Hsieh; Bo-Yuan Chen; Yu-Shao Shiao; Chao-Shun Yang; Guo-Wei Huang; Kai-Shin Li; Ting-Jen Hsueh; Chien-Fu Chen; Wei-Hao Chen; Fu-Liang Yang; Meng-Fan Chang; Wen-Kuan Yeh | ||||
| 2014 | Low-Temperature Microwave Annealing Processes for Future IC Fabrication—A Review | Yao-Jen Lee; Ta-Chun Cho; Shang-Shiun Chuang; Fu-Kuo Hsueh; Yu-Lun Lu; Po-Jung Sung; Hsiu-Chih Chen; Michael I. Current; Tseung-Yuen Tseng; Tien-Sheng Chao; Chenming Hu; Fu-Liang Yang | IEEE TRANSACTIONS ON ELECTRON DEVICES 61, NO.3 |
