| Issue Date | Title | Author(s) | Relation | scopus | WOS | Fulltext/Archive link |
|---|---|---|---|---|---|---|
| 2016 | Designs of Emerging Memory Based Non-Volatile TCAM for Internet-of-Things (IoT) and Big-Data Processing: A 5T2R Universal Cell | Meng-Fan Chang; Ching-Hao Chuang; Yen-Ning Chiang; Shyh-Shyuan Sheu; Chia-Chen Kuo; Hsiang-Yun Cheng; John Sampson; Mary Jane Irwin | ||||
| 2022 | DL-RSIM: A Reliability and Deployment Strategy Simulation Framework for ReRAM-based CNN Accelerators | Wei-Ting Ling; Hsiang-Yun Cheng ; Chia-Lin Yang; Meng-Yao Lin; Kai Lien; Han-Wen Hu; Hung-Sheng Chang; Hsiang-Pang Li; Meng-Fan Chang; Yen-Ting Tsou; Chin-Fu Nien | ACM Transactions on Embedded Computing Systems (TECS) 21(3), 24 | |||
| 2018 | DL-RSIM: a simulation framework to enable reliable ReRAM-based accelerators for deep learning | Meng-Yao Lin; Hsiang-Yun Cheng; Wei-Ting Lin; Tzu-Hsien Yang; I-Ching Tseng; Chia-Lin Yang; Han-Wen Hu; Hung-Sheng Chang; Hsiang-Pang Li; Meng-Fan Chang | ||||
| 2014 | Heterogeneously integrated sub-40nm low-power epi-like Ge/Si monolithic 3D-IC with stacked SiGeC ambient light harvester | Chang-Hong Shen; Jia-Min Shieh; Wen-Hsien Huang; Tsung-Ta Wu; Chien-Fu Chen; Ming-Hsuan Kao; Chih-Chao Yang; Chein-Din Lin; Hsing-Hsiang Wang; Tung-Ying Hsieh; Bo-Yuan Chen; Guo-Wei Huang; Meng-Fan Chang; Fu-Liang Yang | ||||
| 2015 | Low-Cost and TSV-free Monolithic 3D-IC with Heterogeneous Integration of Logic, Memory and Sensor Analogy Circuitry for Internet of Things | Tsung-Ta Wu; Chang-Hong Shen; Jia-Min Shieh; Wen-Hsien Huang; Hsing-Hsiang Wang; Fu-Kuo Hsueh; Hisu-Chih Chen; Chih-Chao Yang; Tung-Ying Hsieh; Bo-Yuan Chen; Yu-Shao Shiao; Chao-Shun Yang; Guo-Wei Huang; Kai-Shin Li; Ting-Jen Hsueh; Chien-Fu Chen; Wei-Hao Chen; Fu-Liang Yang; Meng-Fan Chang; Wen-Kuan Yeh | ||||
| 2013 | Strengthening Modern Electronics Industry Through the National Program for Intelligent Electronics in Taiwan | W. T. Chen; Youn-Long Lin; Chen-Yi Lee; Jeng-Long Chiang; Meng-Fan Chang; Shih-Chieh Chang | IEEE Access 1, 123-130 |
