http://ir.sinica.edu.tw/handle/201000000A/34027| Title: | Leakage mechanism in Cu damascene structure with methylsilane-doped low-k CVD oxide as intermetal dielectrics | Authors: | Z.C. Wu C.C. Chiang W.H. Wu M.C. Chen S. M. Jeng L.J. Li S. M. Jang C.H. Yu M.S. Liang |
Issue Date: | 2001 | Relation: | IEEE ELECTRON DEVICE LETTERS 22, 263 | URI: | http://ir.sinica.edu.tw/handle/201000000A/34027 | ISSN: | http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=Drexel&SrcApp=hagerty_opac&KeyRecord=0741-3106&DestApp=JCR&RQ=IF_CAT_BOXPLOT |
| Appears in Collections: | 應用科學研究中心 |
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