Hybrid stacking structure of electroplated copper onto graphene for future interconnect applications

請用此 Handle URI 來引用此文件： http://ir.sinica.edu.tw/handle/201000000A/49159

題名:	Hybrid stacking structure of electroplated copper onto graphene for future interconnect applications
作者:	Yawen Su Cen-Shawn Wu Chih-Hua Liu Hong-Yi Lin Chii-Dong Chen
公開日期:	2015-09
關聯:	Applied Physics Letters 107, 093105
URI:	http://ir.sinica.edu.tw/handle/201000000A/49159
ISSN:	http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=Drexel&SrcApp=hagerty_opac&KeyRecord=0003-6951&DestApp=JCR&RQ=IF_CAT_BOXPLOT
顯示於：	物理研究所

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