Integration of a (–Cu–S–)n plane in a metal–organic framework affords high electrical conductivity

Please use this identifier to cite or link to this item: http://ir.sinica.edu.tw/handle/201000000A/77796

Title:	Integration of a (–Cu–S–)n plane in a metal–organic framework affords high electrical conductivity
Authors:	Pathak, Abhishek Shen, Jing-Wen Usman, Muhammad Wei, Ling-Fang Mendiratta, Shruti Chang, Yu-Shin Sainbileg, Batjargal Ngue, Chin-May Chen, Ruei-San Hayashi, Michitoshi Luo, Tzuoo-Tsair Chen, Fu-Rong Chen, Kuei-Hsien Tseng, Tien-Wen Chen, Li-Chyong Lu, Kuang-Lieh
Issue Date:	2019-04
Relation:	Nature Communications 10:1721
URI:	http://ir.sinica.edu.tw/handle/201000000A/77796
ISSN:	http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=Drexel&SrcApp=hagerty_opac&KeyRecord=2041-1723&DestApp=JCR&RQ=IF_CAT_BOXPLOT
URL:	http://dx.doi.org/10.1038/s41467-019-09682-0
Appears in Collections:	原子與分子科學研究所

Show full item record

Last Week
0

Last month

checked on Jun 9, 2025

Check