Modelling electrical conduction in nanostructure assemblies through complex networks

請用此 Handle URI 來引用此文件： http://ir.sinica.edu.tw/handle/201000000A/81428

題名:	Modelling electrical conduction in nanostructure assemblies through complex networks
作者:	Yao, Heming Hsieh, Ya-Ping Kong, Jing Hofmann, Mario
公開日期:	2020-07
關聯:	Nature Materials 19, 745-751
URI:	http://ir.sinica.edu.tw/handle/201000000A/81428
ISSN:	http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=Drexel&SrcApp=hagerty_opac&KeyRecord=1476-1122&DestApp=JCR&RQ=IF_CAT_BOXPLOT
URL:	http://dx.doi.org/10.1038/s41563-020-0664-1
顯示於：	原子與分子科學研究所

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